梁先生于1992年在美国麻省理工学院获得博士学位，后在麻省理工做博士后研究员，主要研究结构可靠性和先进材断裂微机理。从1994年到1998年，他在美国洛克韦尔国际公司工作，担任高级研究员和项目经理。1998年他加入总部设在美国麻州的EMC公司（全球最大的信息存储系统生产商)，现任该公司的的科学顾问, 致力于电子封装技术开发，IC、PCB/PCBA制造工艺的研究和可靠性评估。梁博士曾被Marquis载入世界科技名人录，曾任ASM电子材料委员会主席。他撰写了很多材料失效物理方面的技术文章，拥有多项电子制造工艺和设计专利。

Dr. Jin Liang is a science consultant at EMC Corporation (Boston based company, the world leader for information storage systems and solutions), responsible for electronic packaging technology development and interconnect design, IC, PCB/PCBA manufacture progress development and optimization, as well as reliability assessment.  Mr. Liang earned his PhD degree from M.I.T in 1992.  After graduation, he worked as a research associate at MIT on study of aged airplane reliability and micro-mechanisms of fracture for advance materials.  Prior to joining EMC Corp, he worked at Rockwell International from 1994 to 1998 as a senior research scientist.  Dr. Liang was once honored in Marquis's Who Is Who in Science and Technology and served as a former ASM Electronic Materials Characterization Committee Chairperson.  He has extensive technical publications on fundamental material failure physics, and owns several electronic process and design patents.