前言：
电子产品日益小型化、高功耗和环保要求对电子封装和PCB组装以及材料供应商提出了许多挑战。在这次讲座中我们将详细讲解电子元件封装和PCB组装技术以及工艺，并了解组装材料和工艺对最终产品质量和可靠性的影响。例举并讨论组装材料，例如焊料合金、焊膏、助焊剂和芯片粘接材料的主要特性，及评估认证这些材料和工艺优化的方法。对HoHS和无铅加工技术和可靠性进行深入的探讨。进一步，我们将回顾发生在电子元器件和PCB组装中的主要失效机理。我们将以实际案例来讲解产品可靠性评估，寿命预测，HALT/ESS试验方法。
The drive to ever-increased miniaturization, high power dissipation, and more environment-friendly electronics products, presents many challenges not only to the OEMs, but also to packaging houses and PCB assemblers, as well as to material suppliers.  In this lecture we will examine the critical characteristics of assembly materials, such as solder alloys, pastes, fluxes, and die attach materials, by detailed study of component packaging and PCB assembly technologies and processes, and by understanding the effects of these assembly materials and processes on the final product reliability.  Methodologies for assembly materials evaluation, qualification, and process optimization are presented and discussed.  Furthermore, we will review major failure mechanisms operative in electronics components and PCB assemblies.  Practical methods and tools for product reliability assessment, life prediction, HALT/ ESS testing are also presented with actual case studies and examples.

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 授课对象：
本课程着力推荐给电子封装和印刷线路板组装领域内的专业人士，包括技术主管，工艺开发工程师，设计和产品工程师/经理和组装材料供应商。
This class is recommended for professionals in the field of electronics packaging and board assembly, including technical directors, processes development engineers, design and production engineers/managers, and assembly materials suppliers.

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本课程将涵盖以下主题：
主题 Topics 
1、   简介
2、   目前和将来的半导体技术和纳米电子
3、   一级元件封装技术和工艺
4、   板级焊接技术—回流和波峰焊
5、   电子元件封装和印刷电路组装材料
6、   组装材料评估和认证方法，包括RoHS无铅工艺
7、 锡晶须形成及防范措施
8、 电子封装和PCB组装常见失效机理
9、 热传导和热应力分析
10、电子元器件和系统可靠性评估，寿命预测和HALT/ESS测试 
 
Ø   Introduction
Ø       Current and future semiconductor technology, and nano-electronics
Ø       First level component packaging technology and processes
Ø       Board level soldering technology - reflow and wave soldering
Ø       Materials for electronics component packaging and printed circuit assembly
Ø       Board level assembly materials evaluation and qualification methodology, including for RoHS compliance lead-free processing
Ø    Tin whisker formation and mitigation strategy
Ø       Common failure mechanisms in electronic packages and PCB assemblies
Ø       Thermal and stress analyses for first-level and second level interconnections
Ø       Reliability assessment, life predictions, and HALT/ESS testing of electronic components and systems.