Nov.4-6 2008 Int'l Exhibition and Conference for Electronic Packaging and Assembly Technology 2008 Intex Shanghai

　　An Electronic Packaging & Assembly Event

　　EventInternational Exhibition and Conference for Electronics Packaging and Assembly Technology

　　DateNov.4-6 2008

　　VenueINTEX Shanghai 88 Loushan Guan Rd. Shanghai (Xingyi Rd)

　　OrganiserBusiness Media China AG

　　Shanghai Science and Technology Development and Exchange Center (SSTDEC)

　　Supported ByFraunhofer Institute for Reliability and Microintegration(IZM)

　　University of Rostock

　　Supporting AssociationChina Semiconduct Industry Association (CSIA)

　　China Electronic Production Equipment Industry Association (CEPEA)

　　China Electronics Materials Industry Association (CEMIA)

　　Official Websitehttp://www.chinasmtforum.com

　　Company Websitehttp://www.businessmediachina.com

　　Business Media China AG

　　Business Media China AG was originally created and developed by MESAGO HOLDING. MESAGO - Messe & Kongress GmbH is one of the largest names in the international exhibition and conference industry with world leading events such as SMT / HYBRID / PACKAGING in Nuremberg and many more. This company was founded in 1982 by Klaus M. Hilligardt, Chairman of Business Media China AG, and later integrated into MESAGO HOLDING. Business Media China AG is the guarantor for highest standards and successful international participation in technology events.

　　In Shanghai and throughout China, Business Media China has a team of highly qualified exhibition and conference professionals to develop the group's technology exhibition and conference program. China SMT Forum is the first event of a series of technology forums.

　　Industrial Backgroud and Development

　　Rapid developments in the industry and consumer demands generate electronic products that are characterized by smaller-size, high functionality and increased reliability. These trends require constantly new components which are produced by new packaging technologies.

　　With the packaging size getting increasingly smaller, there will be a need for the assembling equipment to catch up with more precise and advanced technology in order to meet the new manufacturing standards. The gap between the suppliers of electronic assembly equipment and the semiconductor industry is going to become more and more smaller, forced by the increasing exchange of technology developments in both sectors.. For example, new packaging technologies like BGA, CSP, etc., are effecting the development of Surface Mount Devices which are one of most important driving forces for innovations in the SMT field.

　　Environmental protection will also set new trends for the industries development. Especially Photovoltaic and LED products will raise the demand for electronic devices and new packaging technologies in China. And all these new products will need OEM and ODM to improve their capabilities on a higher manufacturing level.

　　In order to meet these industrial trends, BMC will present the China SMT Forum 2008 at the INTEX Shanghai from November 4-6, 2008. At the conference and the co-located exhibition for electronic packaging and assembly technology, you will meet your suppliers and clients, specialists and key people from science and industry in packaging and assembling fields

　　You will meet the delegate from

　　4 Electronic Manufacturer (OEM/ODM/EMS)

　　4 Communication Systems or Services

　　4 Automotive Electronics or Transportation

　　4 Computer, Systems and Peripheral Equipment

　　4 Electronics, Semiconductors and ICs

　　4 Photonics (lasers, laser systems, photovoltaics)

　　4 Medical / Hospital and Biotechnology Equipment

　　4 Industrial Electronics

　　4 Micro systems / Mechatronics / Nanotechnology

　　4 Aerospace / Aviation Systems

　　4 Electro-Optical Components, Detectors, Sensors and Cameras

　　4 Analytical, Test & Measurement Equipment, Quality Assurance

　　4 Automation & robotics, Industrial Control Systems

　　4 EHS - Environment, Health, Safety Monitoring

　　4 Electronics: PCBs, Assemblies, Components

　　4 Publications, Printing, Graphic Arts R&D Software (control, etc.)

　　4 Manufacturing Equipment, Machinery, Metal Poducts

　　4 Others

　　Exhibits

　　4 Packaging & Testing Equipment

　　4 Assembly Equipment

　　4 Electronic Modules, Assemblies, Components and devices

　　4 Materials and Tools

　　4 IC Design

　　4 EMS/OEM

　　4 Software

　　4 Consulting & Services

　　4 Publications

　　4 Others

　　A conference focus on Packaging/Assembly/SMT

　　The conference will welcome speakers and delegates from electronic packaging, assembly and system intergration related industry to the most progressive trading platform in China

　　Quality, competence, and an intimate atmosphere for intensive networking are the conceptual ingredients of the China SMT Forum 2008.

　　4The competence of internationally renowned speakers guarantees the high level of the China SMT Forum 2008.

　　4The continuing fertile relationship with the Fraunhofer IZM, Berlin and further international institutions guarantees the presence of the most up-to-date technology at the China SMT Forum 2008.

　　4 Additionally an exclusive exhibition offers selected companies the opportunity to present their products to a highly qualified expert audience.

　　Conference Topic:

　　4Lead-free implementation

　　4PCB and Semiconductor Packaging

　　4Assembly and Soldering

　　4Reliability

　　4Markets and Trends

　　(For more information, please contact organizer)

　　Committee Members

　　Chairman

　　Professor Mathias Nowottnick (University Rostock)

　　Vice Chairman

　　Professor Thomas Gessner (Chemnitz University)

　　Professor Bernd Michel (University of Berlin)

　　Rolf Aschenbrenner(Fraunhofer Institute for Reliability and Microintegration)

　　China Committee Members

　　Mr. Bi Ke-Yun, (Vice Chairman of (CSIA)China Semiconductor Industry

　　Association,Director of Packaging Branch of CSIA)

　　Mr. Jin Cunzhong, (China Electronic Equipment Industry Association)

　　Mr. Jerry Liang, (CTO of Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET)

　　Mr. Jack Ding, (SMT Materials and Semiconductor & Packaging Materials BU

　　Manager of Heraeus Materials Technology Shanghai Ltd.)

　　Mr. Wang Xingqian, (Shanghai Electronic Components Trade Association)

　　Prof. Li Ming, (Shanghai Jiaotong University)

　　Contact：

　　Business Media China Co., Ltd. Shanghai Branch

　　Add: 17H No.18 Cao Xi Bei Road Shanghai, 200030 PR.China

　　Tel: 86-21-5169 3230

　　Fax: 86-21-6427 6277

　　Contact: Steven Wu, Kelly Zhu, Barry Bai

　　E-mail: steven.wu@businessmediachina.com

　　kelly.zhu@businessmediachina.com

　　barry.bai@businessmediachina.com

　　Official Website：www.chinasmtforum.com