| Solderability Tests for Component Leads,Terminations, Lugs,Terminals and Wires |
| 运行环境： Win9x/NT/2000/XP/2003 |
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文件大小： 388 K |
| 软件等级： ★★★ |
软件类别： 其他 |
| 开 发 商： 佚名 |
软件语言： 英文 |
| 相关链接： 下载演示地址 下载注册地址 |
软件属性： 热 |
下载次数： 本日： 本周：
本月： 总计： |
授权方式： 免费版 |
| 解压密码： |
| 软件添加： 审核:smt2000 录入:smt2000 |
添加时间： 2005-10-14 14:40:38 |
Table of Contents
1 SCOPE......................................................................... 1
1.1 Scope .................................................................... 1
1.2 Purpose................................................................. 1
1.3 Method Classification .......................................... 1
1.3.1 Tests with Established Accept/Reject
Criterion ............................................................... 1
1.3.2 Test without Established Accept/Reject
Criterion ............................................................... 1
1.4 Coating Durability ............................................... 1
1.5 Referee Verification Solder Dip for
Tests A, B, C........................................................ 1
1.6 Limitation............................................................. 1
1.7 Contractual Agreement ........................................ 2
2 APPLICABLE DOCUMENTS...................................... 2
2.1 Industry ................................................................ 2
2.1.1 IPC........................................................................ 2
2.2 Government.......................................................... 2
2.2.2 Federal.................................................................. 2
3 REQUIREMENTS ........................................................ 2
3.1 Terms And Definitions......................................... 2
3.2 Materials............................................................... 2
3.2.1 Solder ................................................................... 2
3.2.2 Flux ...................................................................... 2
3.2.3 Flux Removal....................................................... 2
3.2.4 Standard Copper Wrapping Wire ........................ 3
3.3 Equipment ............................................................ 3
3.3.1 Steam Aging Apparatus ....................................... 3
3.3.2 Solder Pot............................................................. 3
3.3.3 Optical Inspection Equipment ............................. 3
3.3.4 Dipping Equipment.............................................. 3
3.3.5 Timing Equipment ............................................... 3
3.4 Preparation for Testing ....................................... 3
3.4.1 Specimen Preparation and Surface
Condition.............................................................. 3
3.4.2 Steam Aging......................................................... 4
3.4.3 Surfaces To Be Tested ......................................... 4
3.5 Solder Bath Requirements................................... 4
3.5.1 Solder Temperatures ............................................ 4
3.5.2 Solder Contamination Control............................. 4
4 TEST PROCEDURES ................................................. 5
4.1 Application of Flux.............................................. 5
4.2 Tests with Established Accept/Reject
Criterion ............................................................... 5
4.2.1 Test A – Solder Bath/Dip and Look Test
(Leads, Wires, etc.) .............................................. 5
4.2.2 Test B – Solder Bath/Dip and Look Test
(Leadless Components)........................................ 7
4.2.3 Test C – Wrapped Wire Test (Lugs, Tabs,
Terminals, Large Stranded Wire) ........................ 7
4.2.4 Test D – Resistance to Dissolution of
Metallization Test................................................. 9
4.2.5 Test S – Surface Mount Process
Simulation Test .................................................... 9
4.3 Tests without Established Accept/Reject
Criterion ............................................................. 10
4.3.1 Test E – Wetting Balance Test (Leaded
Components) ...................................................... 10
4.3.2 Test F – Wetting Balance Test (Leadless
Components) ...................................................... 11
5 NOTES ...................................................................... 13
5.1 Test Equipment Sources .................................... 13
5.1.1 Tests A, B, C, D ............................................... 13
5.1.2 Tests E & F ....................................................... 13
5.1.3 Steam Aging Equipment .................................. 13
5.1.4 Grid Reticles ..................................................... 13
5.2 Use of Non-Activated Flux ............................... 13
5.3 Massive Components......................................... 13
5.4 Sampling Plans .................................................. 13
5.5 Safety Notes....................................................... 13
5.6 Correction for Buoyancy ................................... 13
5.7 Test Specimens................................................... 14
5.8 Accelerated Steam Aging Limitations .............. 14
5.9 Referee Magnification........................................ 14
Appendix A ................................................................. 15
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