Moisture/Reflow Sensitivity Classification for Non-Hermetic Solid State Surface Mount Devices-PCB相关资料-smt专家网

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Moisture/Reflow Sensitivity Classification for Non-Hermetic Solid State Surface Mount Devices

运行环境： Win9x/NT/2000/XP/2003		文件大小： 0 K
软件等级：		软件类别：其他
开发商：佚名		软件语言：英文
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软件添加：审核:smt2000 录入:smt2000		添加时间： 2005-10-12 10:45:09

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::软件简介::

1 PURPOSE.................................................................... 1
2 SCOPE......................................................................... 1
3 BACKGROUND........................................................... 1
4 APPLICABLE DOCUMENTS ..................................... 1
5 APPARATUS .............................................................. 2
5.1 Temperature Humidity Chambers......................... 2
5.2 Solder Reflow Equipment ................................... 2
5.3 Ovens..................................................................... 2
5.4 Microscopes ......................................................... 2
5.5 Cross-Sectioning ................................................... 2
5.6 Electrical Test........................................................ 2
5.7 Weighing Apparatus (Optional) ............................ 2
6 CLASSIFICATION/RECLASSIFICATION.................... 2
6.1 Reclassification...................................................... 3
7 PROCEDURE .............................................................. 3
7.1 Sample Requirements .......................................... 3
7.1.1 Reclassification (qualified package without
additional reliability testing)................................. 3
7.1.2 Classification/Reclassification (additional
qualification/reliability testing is planned) .......... 3
7.2 Electrical Test........................................................ 4
7.3 Initial Inspection ................................................... 4
7.4 Bake....................................................................... 4
7.5 Moisture Soak ....................................................... 4
7.6 Reflow ................................................................... 4
7.7 External Visual ...................................................... 5
7.8 Electrical Test........................................................ 5
7.9 Acoustic Microscopy ............................................ 5
8 CRITERIA .................................................................. 5
8.1 Failure Criteria ...................................................... 5
8.2 Criteria Requiring Further Evaluation.................. 5
8.2.1 Delamination ......................................................... 5
8.3 Failure Verification................................................ 6
9 MOISTURE/REFLOW SENSITIVITY
CLASSIFICATION .................................................... 6
10 OPTIONAL WEIGHT GAIN/LOSS ANALYSIS....... 6
10.1 Weight Gain .......................................................... 6
10.2 Absorption Curve ................................................. 7
10.2.1 Read Points ........................................................... 7
10.2.2 Dry Weight ............................................................ 7
10.2.3 Moisture Soak ....................................................... 7
10.2.4 Readouts ................................................................ 7
10.3 Desorption Curve .................................................. 7
10.3.1 Read Points ........................................................... 7
10.3.2 Baking ................................................................... 7
10.3.3 Readouts ................................................................ 7
11 ADDITIONS AND EXCEPTIONS .............................. 7
APPENDIX A Classification Flow ................................ 9
Tables
Table 1 Package Reflow Conditions ................................. 3
Table 2 Moisture Sensitivity Levels................................... 4
Table 3 Classification Reflow Profiles ............................... 5

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