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JOINT INDUSTRY STANDARD(2)
运行环境: Win9x/NT/2000/XP/2003 文件大小: 0 K
软件等级:  软件类别: 其他
开 发 商: 佚名 软件语言: 英文
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软件添加: 审核:smt2000 录入:smt2000 添加时间: 2005-10-12 10:43:00
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::软件简介::
Notice EIA/JEDEC and IPC Standards and Publications are designed to serve the
public interest through eliminating misunderstandings between manufacturers
and purchasers, facilitating interchangeability and improvement of products,
and assisting the purchaser in selecting and obtaining with minimum delay
the proper product for his particular need. Existence of such Standards and
Publications shall not in any respect preclude any member or nonmember of
EIA/JEDEC or IPC from manufacturing or selling products not conforming
to such Standards and Publications, nor shall the existence of such Standards
and Publications preclude their voluntary use by those other than EIA/JEDEC
and IPC members, whether the standard is to be used either domestically or
internationally.
Recommended Standards and Publications are adopted by EIA/JEDEC and
IPC without regard to whether their adoption may involve patents on articles,
materials, or processes. By such action, EIA/JEDEC and IPC do not assume
any liability to any patent owner, nor do they assume any obligation whatever
to parties adopting the Recommended Standard or Publication. Users are also
wholly responsible for protecting themselves against all claims of liabilities for
patent infringement.
The material in this joint standard was developed by the EIA/JEDEC JC-14.1
Committee on Reliability Test Methods for Packaged Devices and the IPC
Plastic Chip Carrier Cracking Task Group (B-10a)
The J-STD-033 supersedes JESD22-A112 and IPC-SM-786.
......
::相关软件::
JOINT INDUSTRY STANDARD
JOINT INDUSTRY STANDARD
JOINT INDUSTRY STANDARD
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