IPC-CA-821	General Requirements for Thermally Conductive Adhesives 导热胶粘剂通用要求
IPC-3406	Guidelines for Electrically Conductive Surface Mount Adhesives 表面贴装导电胶使用指南
IPC-3408	General Requirements for Anisotropically Conductive Adhesives Films 各向异性导电胶膜的一般要求
IPC-CC-830B	Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies 印制板组装电气绝缘性能和质量手册
IPC-HDBK-830	Guideline for Design, Selection and Application of Conformal Coatings 敷形涂层的设计，选择和应用手册
IPC-SM-840C	Qualification and Performance of Permanent Solder Mask - Includes Amendment 1 永久性阻焊剂的鉴定及性能(包括修改单1)
IPC-HDBK-840	Guide to Solder Paste Assessment 焊膏性能评价手册
IPC-TP-1114	The Layman’s Guide to Qualifying a Process to J-STD-001 基于J-STD-001组装工艺雷氏选择法
IPC-TR-467	Supporting Data & Numerical Examples for J-STD-001 (Control of Fluxes) J-STD-001(焊剂控制)的支持数据及数字实例
IPC-AJ-820	Assembly & Joining Handbook 装联手册
IPC-7530	Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes 大规模焊接(回流焊与波峰焊)过程温度曲线指南
IPC-9701	Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments 表面安装锡焊件性能试验方法与鉴定要求
IPC-TP-1090	The Layman’s Guide to Qualifying New Fluxes 新型助焊剂雷氏选择法
IPC-TP-1115	Selection and Implementation Strategy for a Low-Residue No-Clean Process 低残留不清洗工艺的选择和实施
IPC-S-816	SMT Process Guideline & Checklist 表面安装技术过程导则及检核表
IPC-TR-460A	Trouble-Shooting Checklist for Wave Soldering Printed Wiring Boards 印制板波峰焊故障排除检查表
IPC-CM-770D	Component Mounting Guidelines for Printed Boards 印制板元件安装导则
IPC-7912	Calculation of DPMO & Manufacturing Indices for Printed Board Assemblies 印制板和电子组装件每百万件缺陷数(DPMO)和制造指数的计算
IPC-9261	In-Process DPMO and Estimated Yield for PWAs 印制板组装过程中每百万件缺陷数(DPMO)及合格率估计
IPC-9501	PWB Assembly Process Simulation for Evaluation of Electronic Components 电子元件的印制板组装过程模拟评价
IPC-9502	PWB Assembly Soldering Process Guideline for Electronic Components 电子元件的印制板组装焊接过导则
IPC-9503	Moisture Sensitivity Classification for Non-IC Components 非集成电路元件的湿度敏感度分级
IPC-9504	Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning Non-IC Components) 非集成电路元件的组装过程模拟评价（非集成电路元件预处理）
IPC-9850-K	Surface Mount Placement Equipment Characterization-KIT 表面贴装设备性能检测方法的描述（附Gerber格式CD盘）
IPC-9850-TM-KW, IPC-9850-TM-K	Test Materials Kit for Surface Mount Placement Equipment Standardization 表面贴装设备性能测试用的标准工具包 • 4 IPC-9850 Placement Accuracy Verification Panels • 1 IPC-9850 CMM Measurement Verification Panels • 150 IPC-9850 QFP-100 Glass Components • 130 IPC-9850 QFP-208 Glass Components • 150 IPC-9850 BGA-228 Glass Components • NIST Traceable Measurement Certificate • Custom Storage Case
IPC-7711/21 7711 & 7721	Package 合订本
IPC-7711	Rework of Electronic Assemblies 电子组装件的返工
IPC-7721	Repair and Modification of Printed Boards and Electronic Assemblies 印制板和电子组装件的修复与修正
IPC/EIA J-STD-002B	Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires 元件引线、端子、焊片、接线柱及导线可焊性试验
IPC/EIA J-STD-003	Solderability Tests for Printed Boards 印制板可焊性试验
IPC-TR-461	Trouble-Shooting Checklist for Wave Soldering Printed Wiring Boards 印制板波峰焊故障排除检查表
IPC-TR-462	Solderability Evaluation of Printed Boards with Protective Coatings Over Long-term Storage 带保护性涂层印制板长期贮存的可焊性评价
IPC-TR-464	Accelerated Aging for Solderability Evaluations 可焊性加速老化评价(附修订)
IPC-TR-465-1	Round Robin Test on Steam Ager Temperature Control Stability 蒸汽老化器温度控制稳定性联合试验
IPC-TR-465-2	The Effect of Steam Aging Time and Temperature on Solderability Test Results 蒸汽老化时间与温度对可焊性试验结果的影响
IPC-TR-465-3	Evaluation of Steam Aging on Alternative Finishes, Phase IIA 替代涂覆层的蒸汽老化评价
IPC-TR-466	Technical Report: Wetting Balance Standard Weight Comparison Test 技术报告: 润湿天平称重标准对比测试
SMC-WP-001	Soldering Capability White Paper Report 可焊性工艺导论
SMC-WP-005	PCB Surface Finishes 印制电路板表面清洗