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The difference between Lead-free & tin-lead wave soldering machine无铅波峰焊接机与普通波峰焊接机的区别
1:Length of preheating预热长度
Lead-free wave soldering machine无铅波峰焊接机 1.8m
Conventional wave soldering machine普通波峰焊接机 1.0m左右
Due to higher melting point and soldering temperature for lead-free solders, a longer preheating time is required to ensure the PCB is properly preheated. 因为无铅焊料的熔点较高,焊接温度很高,因此需要较长的预热时间,使PCB吸收足够热量,为焊接作好准备。
2:热补偿
Lead free wave soldering machine无铅波峰焊接机 有
Conventional wave soldering machine普通波峰焊接机 无
Lead-free solder will require sufficient heat during soldering, this is to prevent the loss of heat in PCB after preheating and before soldering, in order to prevent poor solderability such as cold solder. 因为无铅焊接前需要足够的热量,如果在焊接前PCB的温度过度散失,会造成很多焊接不良,如冷焊等
3:Distance between solder wave两波峰的间距
Lead-free wave soldering machine无铅波峰焊接机 60㎜左右
Conventional wave soldering machine普通波峰焊接机 120㎜左右
It is advise to shorten the distance between two solder wave, this is to prevent the loss of heat from the PCB after first solder wave and cause poor solderability during second wave. 尽量缩短两波峰的间距是为了防止PCB在经过第一波峰后散失过多的热量,在第二波峰焊接时而造成焊锡不良
4:炉胆
无铅波峰焊接机 Titanium alloy钛合金炉胆
普通波峰焊接机 Stainless steel不锈钢炉胆
High tin solder are very corrosive to stainless steel, lead-free solder will corrode the solder pot after a period of time, solder pot made from Titanium alloy will help to prevent the corrosion.因为无铅焊锡的腐蚀性很强,不锈钢炉胆使用一段时间后便会被击穿,钛合金炉胆便会有效的防止腐蚀
5:Nitrogen氮气
无铅波峰焊接机 有
普通波峰焊接机 无
During lead-free soldering, the oxidation rate is very high, so it is preferable to use Nitrogen protection. The wetting of lead-free solder is weaker than tin-lead solders, by using Nitrogen atmosphere during lead-free soldering and improve wetting and soldeability of the solders.因为在进行无铅焊接的时候,无铅锡很容易被氧化,所以炉体内需要氮气进行保护。另外无铅焊锡的浸润性比有铅焊锡差,充入氮气进行焊接时有助于良好的焊接。如锡点上锡饱满等
6:Flux reclaim system助焊剂回收系统
无铅波峰焊接机 有
普通波峰焊接机 无
Lead-free soldering are using closed type wave soldering wave, this will prohibit the fumes from the flux to escape from the machine chamber, if the fumes are trapped in side the machine, it will contaminate the environment of the machine chamber, and will affect the ventilation and heating systems of the machine. Excessive flux residues will drop onto the PCB and contaminate the PCB.无铅焊接一般采用密闭式焊接,因此炉膛内的助焊剂烟气不易排出炉外,如果滞留在炉内将会污染整个炉膛,久而久之积累太多时会影响炉子的通风系统及发热系统。甚至过多的助焊剂残留会滴到PCB上,从而污染PCB。
7:Fast cooling system急速冷却系统
无铅波峰焊接机 有
普通波峰焊接机 无
during the soldering of lead-free solders, blowholes and pad lifting problems will often occur, by applying cooling systems at 10℃, can solve the above problems.无铅焊锡在焊接时容易产生空泡及焊盘剥离等问题,在出口处使用可达10℃的冷气系统,可明显改变上述问题。
Notes附注:The above mentioned are only reference of the difference between lead-free and conventional tin-lead wave soldering machine. More technical analysis is required during soldering process. 以上所述均为无铅波峰焊接机与普通波峰焊接机一些最基本的区别。在具体的焊接时还需作具体的工艺分析。
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